High-Precision Laser Bonding Specialist

2 days ago

Singapore beBeeLaserAssistedBonder Full time $6,000 - $8,000

Job Title: Laser-Assisted Bonder Process Engineer

 

The role involves developing, optimizing and maintaining laser bonding processes for high-precision and high-reliability applications. Key responsibilities include process development, scale-up and qualification, equipment management, troubleshooting and support, and continuous improvement.

 

  • To be successful in this role, you will need to have a strong understanding of laser bonding technology and its applications in advanced packaging. You will also need to be able to work effectively with cross-functional teams, including R&D, production, and maintenance.

 

About the Role

This is an exciting opportunity to join our organization as a laser-assisted bonder process engineer. In this role, you will be responsible for developing, implementing and optimizing laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.

 

Key Responsibilities

Process Development & Optimization: Develop, implement and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.

Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.

Equipment & Program Management: Specify, program and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.

Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.

Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).

 

What We Offer

We offer a competitive salary package, comprehensive benefits, and opportunities for career growth and development. If you are a motivated and experienced professional looking for a new challenge, we encourage you to apply.

 

Laser Bonding Technology

Laser bonding technology is a key enabler for the development of next-generation electronic devices. It offers several advantages over traditional bonding methods, including higher yields, improved quality, and increased productivity.

 

Requirements

To be successful in this role, you will need to have a strong understanding of laser bonding technology and its applications in advanced packaging. You will also need to be able to work effectively with cross-functional teams, including R&D, production, and maintenance.

 

Skill Requirements

The ideal candidate will have a strong background in materials science, physics, or engineering, with experience in laser bonding technology and its applications. Additionally, you will need to have excellent communication and teamwork skills, as well as the ability to work in a fast-paced environment.

 

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