
Senior Laser Engineer
1 week ago
Laser-Assisted Bonder is a pivotal role that plays a critical part in the development and optimization of high-precision, high-reliability Advanced Packaging applications.
The successful candidate will be responsible for developing, implementing, and optimizing laser-assisted bonding processes to achieve maximum yield, quality, and throughput.
- Process Development & Optimization: The ideal candidate will develop and refine laser-assisted bonding processes to achieve the highest possible yield, quality, and throughput.
- Scale-Up & Qualification: This role involves qualifying new laser bonding processes from R&D to high-volume production, ensuring seamless transition and minimal disruption.
- Equipment & Program Management: The successful candidate will specify, program, and refine laser bonder equipment and processes to ensure optimal performance.
- Troubleshooting & Support: Troubleshooting laser systems and bonding processes to resolve yield, quality, and reliability issues is an essential aspect of this role.
- Continuous Improvement: Leading initiatives to improve yield, cycle time, and cost using data-driven methodologies is a key responsibility of this position.
- Documentation: Maintaining accurate records of process parameters, recipes, and results is crucial for this role.
- Cross-Functional Collaboration: Working closely with R&D, operations, maintenance, and quality teams is necessary to ensure effective communication and collaboration.
- Safety & Compliance: Ensuring adherence to laser safety regulations and best practices is essential for this role.
- Customer & Project Support: Providing technical insights and support for customer programs and technology upgrades is a key aspect of this position.
Requirements:
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2–5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
- Experience with Laser-Assisted Bonding Technologies is highly preferred.
- Familiarity with bonding equipment and analytical tools.
- Familiarity with advanced process control and manufacturing best practices.
- Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis skills.
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