Senior Laser Engineer

1 week ago


Singapore beBeeEngineering Full time $100,000 - $150,000
Job Title

Laser-Assisted Bonder is a pivotal role that plays a critical part in the development and optimization of high-precision, high-reliability Advanced Packaging applications.

The successful candidate will be responsible for developing, implementing, and optimizing laser-assisted bonding processes to achieve maximum yield, quality, and throughput.

  • Process Development & Optimization: The ideal candidate will develop and refine laser-assisted bonding processes to achieve the highest possible yield, quality, and throughput.
  • Scale-Up & Qualification: This role involves qualifying new laser bonding processes from R&D to high-volume production, ensuring seamless transition and minimal disruption.
  • Equipment & Program Management: The successful candidate will specify, program, and refine laser bonder equipment and processes to ensure optimal performance.
  • Troubleshooting & Support: Troubleshooting laser systems and bonding processes to resolve yield, quality, and reliability issues is an essential aspect of this role.
  • Continuous Improvement: Leading initiatives to improve yield, cycle time, and cost using data-driven methodologies is a key responsibility of this position.
  • Documentation: Maintaining accurate records of process parameters, recipes, and results is crucial for this role.
  • Cross-Functional Collaboration: Working closely with R&D, operations, maintenance, and quality teams is necessary to ensure effective communication and collaboration.
  • Safety & Compliance: Ensuring adherence to laser safety regulations and best practices is essential for this role.
  • Customer & Project Support: Providing technical insights and support for customer programs and technology upgrades is a key aspect of this position.

Requirements:

  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
  • Experience with Laser-Assisted Bonding Technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools.
  • Familiarity with advanced process control and manufacturing best practices.
  • Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis skills.


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