
Senior Laser Bonding Engineer
1 day ago
Laser Bonding Process Engineer is responsible for developing and optimizing laser-assisted bonding processes for chip-to-wafer and chip-to-substrate packaging. The successful candidate will scale processes from R&D to high-volume production, program and troubleshoot laser bonder equipment, and improve yield, quality, and throughput using DOE, SPC, and Six Sigma.
Key Responsibilities:
- Develop and optimize Laser-Assisted Bonding processes for Chip-to-Wafer/Chip-to-Substrate packaging.
- Scale processes from R&D to High-Volume Production.
- Program and troubleshoot Laser Bonder equipment (Hardware/Software).
- Improve Yield, Quality & Throughput using DOE, SPC, Six Sigma.
- Support NPI, Customer Projects & Failure Analysis.
- Ensure Laser Safety & Compliance in Production.
The ideal candidate should have a degree in Materials, Mechanical, or Electrical Engineering and 2-5 years of experience in Semiconductor Packaging or Advanced Interconnects. Experience with Laser bonding/Optical systems is preferred. Knowledge of X-ray, SAM, OM inspection tools, FMEA, Statistical analysis (JMP/Minitab), and strong communication skills are also required.
Requirements:
- Degree in Materials/Mechanical/Electrical Engineering.
- 2-5 years in Semiconductor Packaging/Advanced Interconnects.
- Experience with Laser bonding/Optical systems (preferred).
- Knowledge of X-ray, SAM, OM inspection tools.
- Strong in FMEA, Statistical analysis (JMP/Minitab).
This role offers opportunities for growth and development in a dynamic and innovative environment. We offer competitive compensation and benefits packages, including a comprehensive health insurance plan, retirement savings plan, and paid time off.
Other Benefits:
- Tell employers what skills you have
- FMEA
- Hardware
- Throughput
- Compliance
- Packaging
- SPC
- Electrical Engineering
- Six Sigma
- Failure Analysis
- Minitab
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