Expert Laser Bonding Engineer

2 days ago


Singapore beBeeLaserBonding Full time $6,000 - $8,000
Advanced Interconnect Specialist

We are seeking an experienced Advanced Interconnect Specialist to join our team. The successful candidate will be responsible for developing and optimizing laser-assisted bonding processes for chip-to-wafer and chip-to-substrate packaging.

  • Program and troubleshoot laser bonder equipment to ensure optimal performance.
  • Apply statistical analysis techniques to improve yield, quality, and throughput.
  • Collaborate with cross-functional teams to support new product introduction, customer projects, and failure analysis.

Requirements:

  • Degree in Materials Science, Mechanical Engineering, or Electrical Engineering.
  • Minimum 2 years of experience in semiconductor packaging or advanced interconnects.
  • Knowledge of laser bonding and optical systems is a plus.
  • Familiarity with X-ray, SAM, OM inspection tools and FMEA techniques.
  • Strong analytical skills and ability to work independently.

Key Responsibilities:

  1. Laser-Assisted Bonding Process Development
  2. Equipment Programming and Troubleshooting
  3. Statistical Analysis and Quality Improvement
  4. Cross-Functional Collaboration

About the Role:

This is a unique opportunity to join our team and contribute to the development of cutting-edge interconnect technologies. If you have a passion for innovation and a drive to succeed, we encourage you to apply.



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