Advanced Laser Bonding Specialist

1 day ago

Singapore beBeePackaging Full time $90,000 - $120,000

**Job Title:** Advanced Packaging Process Engineer

As a skilled Process Engineer, you will be responsible for developing, optimizing, and maintaining laser bonding processes for advanced packaging applications.

  • Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.
  • Qualify new laser bonding processes from R&D to high-volume production.
  • Specify, program, and refine laser bonder equipment and processes.

**Key Responsibilities:

  1. Process Development & Optimization: Develop and implement laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.
  2. Process Qualification: Qualify new laser bonding processes from R&D to high-volume production.
  3. Equipment Management: Specify, program, and refine laser bonder equipment and processes.

**Requirements:

  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2-5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
  • Experience with Laser Assisted bonding technologies is highly preferred.

**Desired Skills:

  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).
  • Familiarity with advanced process control and manufacturing best practices.
  • Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).

**What We Offer:

We offer a competitive salary and benefits package, as well as opportunities for professional growth and development.

**How to Apply:

Please submit your resume and cover letter to us via email. We look forward to hearing from you.

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