Advanced Laser Bonding Specialist

10 hours ago

Singapore beBeeLaserBonding Full time

Job Opportunity

The Laser Bonding Specialist is responsible for developing, optimizing, and maintaining advanced laser bonding processes—especially in high-precision, high-reliability applications for Chip-to-Wafer or Chip-to-Substrate bonding.

Main Responsibilities:

Laser-Assisted Bonding Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput. Process Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams. Equipment Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products. Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams. Continuous Process Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as Statistical Process Control (SPC) and Six Sigma tools. Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology

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