Advanced Packaging Engineer

2 weeks ago

Singapore beBeeEngineering Full time $6,000 - $8,000
Job Title: Advanced Packaging Engineer (Laser Bonding Specialist)

Job Summary: We are seeking a highly skilled Advanced Packaging Engineer to lead the development and optimization of laser bonding processes for our cutting-edge packaging applications. The ideal candidate will have expertise in process engineering, equipment management, and team collaboration.

Responsibilities:
  • Develop and implement innovative laser-assisted bonding processes for advanced interconnects and micro-assembly.
  • Collaborate with R&D and production teams to qualify new processes from concept to high-volume production.
  • Specify, program, and refine laser bonder equipment and processes to ensure optimal hardware and software configurations.
  • Troubleshoot complex issues in laser systems and bonding processes, analyzing and resolving yield, quality, and reliability problems.
  • Lead initiatives to improve yield, cycle time, and cost using data-driven methodologies like SPC, DOE, and Six Sigma tools.

Requirements & Qualifications:
• Master's degree in Engineering or related field.
• 5+ years of experience in process engineering, equipment management, or related field.
• Expertise in laser bonding, process development, and equipment management.
• Strong analytical and problem-solving skills, with ability to troubleshoot complex issues.
• Excellent communication and collaboration skills, with experience working with cross-functional teams.

Benefits:
- Competitive salary range.
- Comprehensive benefits package, including health insurance, retirement plan, and paid time off.
- Opportunities for professional growth and development.
- Collaborative and dynamic work environment.

How to Apply:
If you are a motivated and detail-oriented engineer with expertise in laser bonding and process development, please submit your application with your resume and cover letter.

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