Advanced Bonding Process Engineer

14 hours ago

Singapore beBeeBonding Full time $90,000 - $120,000

We are seeking a highly skilled Advanced Bonding Process Engineer to develop and optimize laser bonding processes for advanced packaging applications.

This role requires a deep understanding of bonding technologies, materials science, and equipment operation. You will work closely with cross-functional teams to develop and implement new bonding processes, optimize existing ones, and troubleshoot issues related to yield, quality, and reliability.

Key Responsibilities:

  • Develop and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly
  • Qualify new laser bonding processes from R&D to high-volume production
  • Specify, program, and refine laser bonder equipment and processes
  • Troubleshoot laser systems and bonding processes
  • Lead initiatives to improve yield, cycle time, and cost using data-driven methodologies

Requirements:

  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field
  • Minimum 2-5 years of hands-on experience in design and development of equipment or semiconductor packaging processes
  • Experience with Laser Assisted bonding technologies is highly preferred
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
  • Familiarity with advanced process control and manufacturing best practices
  • Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis skills

This is an exciting opportunity to work on cutting-edge bonding technologies and contribute to the development of next-generation packaging solutions.

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