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2 days ago
We are seeking a highly skilled Design Engineer to join our team. As a TCB (Thermo Compression Bonding) Design Engineer, you will be responsible for designing and developing innovative solutions for Chip-to-Wafer/Chip-to-Substrate bonding.
Main Responsibilities:- TCB Module Design: Design high-performance TCB modules that meet thermal requirements.
- Prototyping and Testing: Manage prototyping, testing, and troubleshooting of designed TCB modules.
- Thermal Optimization: Optimize heating and cooling systems through advanced thermal simulations.
- Cross-Functional Collaboration: Collaborate with electrical, vision, and software teams to integrate machine components.
- Degree in Relevant Field: A degree in Materials Science or Mechanical/Electrical Engineering.
- Experience in Semiconductor Equipment Design: 2–5 years of experience in Semiconductor Equipment Design or packaging.
- CAD Skills: Proficiency in CAD software, preferably CREO Parametric, and PLM (Windchill a plus).
- Bonding Tools and Processes: Knowledge of bonding tools and processes is required.
This role offers the opportunity to work on cutting-edge technology and collaborate with cross-functional teams. If you have a passion for design engineering and want to contribute to innovative projects, this could be the perfect fit for you.
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Singapore beBeeDesignEngineer Full timeDesign Engineer (Thermo Compression Bonding) We are seeking a highly skilled Design Engineer to join our team. As a TCB (Thermo Compression Bonding) Design Engineer, you will be responsible for designing and developing innovative solutions for Chip-to-Wafer/Chip-to-Substrate bonding. Main Responsibilities: TCB Module Design : Design high-performance...
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