Semiconductor Bonding Specialist
1 week ago
Job Description:
A semiconductor bonding specialist is responsible for the development, optimization, and maintenance of advanced packaging applications in chip-to-wafer or chip-to-substrate bonding.
Key Responsibilities:
- Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
- Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
- Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
- Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
- Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
Benefits:
The ideal candidate will have strong knowledge of laser bonding processes, materials science, and process optimization techniques. Additionally, excellent communication and teamwork skills are essential for success in this role.
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