Expertise in Thermocompression Bonding Specialist

Seamless bonding and integration of semiconductor components require a highly skilled TCB System Specialist. This role involves the design, development, and optimization of TCB modules for advanced packaging processes.The ideal candidate will have expertise in thermal management, mechanical engineering, and materials science. They should be able to analyze...

Overview Position title: TCB (Thermo Compression Bonding) Process Engineer Location: North Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $5000 - $8000 (depends experience)Interested applicants can also send your resume to WA: (Ms Angel) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for...

Job Title: Semiconductor Bonding Specialist - Advanced Packaging ApplicationsJob Description:A semiconductor bonding specialist is responsible for the development, optimization, and maintenance of advanced packaging applications in chip-to-wafer or chip-to-substrate bonding.Key Responsibilities:Process Development & Optimization: Develop, implement, and...

Job Title: High-Precision Bonding SpecialistKey Responsibilities:Develop and implement advanced bonding processes for product packaging, interconnects, and micro-assembly.Scale up new processes from R&D to high-volume production, collaborating with development and production teams.Specify, program, and refine laser bonder equipment and processes for various...

Job DescriptionA Bonding Process Specialist is responsible for developing, implementing and optimizing laser-assisted bonding processes, especially in high-precision and high-reliability applications.This role involves working with cross-functional teams to design, develop, and qualify new bonding processes and equipment. The ideal candidate will have a...

Job Description A Bonding Process Specialist is responsible for developing, implementing and optimizing laser-assisted bonding processes, especially in high-precision and high-reliability applications. This role involves working with cross-functional teams to design, develop, and qualify new bonding processes and equipment. The ideal candidate will have...

Job Title: Advanced Packaging Engineer (Laser Bonding Specialist) Job Summary: We are seeking a highly skilled Advanced Packaging Engineer to lead the development and optimization of laser bonding processes for our cutting-edge packaging applications. The ideal candidate will have expertise in process engineering, equipment management, and team...

Job Opportunity The Laser Bonding Specialist is responsible for developing, optimizing, and maintaining advanced laser bonding processes—especially in high-precision, high-reliability applications for Chip-to-Wafer or Chip-to-Substrate bonding. Main Responsibilities: Laser-Assisted Bonding Development & Optimization: Develop, implement, and optimize...

**Summary** Posted: 26 Nov 2024 Role Number**:200558465** **Description** - Work on process equipment to conduct proof of concept evaluation and DOEs - Establishment of baseline process and metrics - Perform process characterisation - Establish design guidelines for manufacturability - Define procedures and metrologies - Generate engineering report base...

**Roles / Responsibilities**: - To perform qualification on semi-conductor packaging equipment through verification of machine calibration, setup and process bonding on semiconductor packaging equipment - Identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time - Develop and qualify...