Advanced Packaging Solutions Engineer

2 weeks ago

Singapore beBeeRdEngineer Full time
Job Opportunity

At our company, we are seeking an experienced 3D Heterogeneous Integration R&D Engineer to drive thermal solutions for next-generation hybrid bonding development.

The successful candidate will lead process development efforts for establishing thermal solutions required for advanced packaging solutions. This will involve working with unit process engineers, manufacturing engineers, and directly with tools & materials in our semiconductor fabs.

Key responsibilities include driving end-to-end process integration and planning to enable new capability planning, early product prototyping, and qualification across multiple programs. The engineer will also develop expertise in processes, materials, and tooling and leverage available characterization resources to improve yields and reduce cycle time & costs.

Additionally, the role involves collaborating with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes, understanding failure modes, and facilitating interactions between fab teams and customers. The successful candidate will also be responsible for generating IP related to novel wafer integration & packaging technology.

Other responsibilities include performing all activities in a safe and responsible manner and supporting Environmental, Health, Safety & Security requirements and programs. The engineer may also be involved in hiring and mentoring other team members and will take part in various other duties assigned by their manager.

To be eligible for this role, candidates must have a Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or a related field from an accredited degree program. A minimum of 10 years' work experience in a related field is required, as well as language fluency in English (written and verbal). Travel is expected to be up to 20% of the time.

Preferred qualifications include PhD education level, prior leadership experience, project management skills, strong written and verbal communication skills, and strong planning & organizational skills.

  • Management Skills
  • Integration
  • Materials Science
  • Process Integration
  • 3D
  • Fabrication
  • Environmental Health
  • Project Management
  • Characterization
  • IP
  • Packaging
  • Assembly
  • Manufacturing
  • Electrical Engineering
  • Chemical Engineering
  • Mechanical Engineering

  • Advanced Packaging Solutions Engineer

    2 weeks ago

    Singapore beBeeIntegration Full time $80,000 - $120,000

    Job Title Seeking a development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ultra-low power CMOS platforms.">Key Responsibilities:Develop and integrate advanced packaging processes for ULP CMOS platforms.Lead the development of D2W and W2W bonding...

  • Advanced Packaging Engineer

    2 weeks ago

    Singapore beBeePackaging Full time $90,000 - $120,000

    Advanced Packaging EngineerWe are seeking a skilled Advanced Packaging Engineer to join our team. In this role, you will be responsible for the development and implementation of advanced packaging solutions for high-performance memory products.About the RoleThis is an exciting opportunity for a motivated and experienced engineer to take on new challenges and...

  • Advanced Packaging Solutions Leader

    2 weeks ago

    Singapore beBeePackaging Full time

    Advanced Packaging Solutions Lead Job Overview The Advanced Packaging Solutions Lead is responsible for spearheading the development of cutting-edge packaging solutions that align with our strategic vision. Key Responsibilities Oversee a team of researchers and engineers in the development of advanced packaging solutions. Manage multiple R&D projects...

  • Advanced Packaging Solutions Specialist

    1 week ago

    Singapore beBeePackaging Full time $120,000 - $200,000

    Job Title: Advanced Packaging Solutions SpecialistJob Summary:We are seeking an experienced Advanced Packaging Solutions Specialist to drive thermal solutions for next-generation hybrid bonding development.Key Responsibilities:Lead process development efforts for establishing thermal solutions required for advanced packaging solutions needed in product lines...

  • Advanced Packaging Solutions Innovator

    7 days ago

    Singapore beBeeInnovation Full time $120,000 - $180,000

    Job Title:R&D Manager - Innovation LeaderJob Description:We are seeking an experienced research and development manager to lead our team in developing innovative packaging solutions. The successful candidate will have a strong technical background, excellent leadership skills, and the ability to manage complex projects.Main Responsibilities:Lead and mentor a...

  • Advanced Packaging Solutions Expert

    1 week ago

    Singapore beBeePackaging Full time $90,000 - $120,000

    Job OpportunitySeeking a development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ultra-low power (ULP) CMOS platforms.The role spans from early-stage process development through to manufacturing. Key responsibilities include:Developing and implementing...

  • Advanced Packaging Solutions Specialist

    1 week ago

    Singapore beBeePackaging Full time $80,000 - $120,000

    Job Title: Advanced Packaging Solutions SpecialistDescription:We are seeking a highly skilled engineer to join our team in developing innovative packaging solutions for wafer-level manufacturing.The successful candidate will be responsible for designing, optimizing, and implementing cutting-edge technologies to enhance product quality and efficiency.This...

  • Advanced Packaging Solutions Specialist

    2 weeks ago

    Singapore beBeePackaging Full time $120,000 - $180,000

    **Job Title:** Advanced Packaging R&D Engineer","Are you an innovative and experienced engineer looking to drive cutting-edge thermal solutions in advanced packaging?","Job Description:","Lead the development of 3D Heterogeneous Integration (3DHI) processes for thermal solutions in advanced packaging.","Collaborate with cross-functional teams to integrate...

  • Advanced Packaging Solutions Manager

    2 weeks ago

    Singapore beBeePackaging Full time $90,000 - $120,000

    Senior Packaging Strategist RoleWe are seeking a highly skilled and experienced Senior Packaging Strategist to spearhead the development of cutting-edge packaging solutions that align with our strategic vision.This role will oversee a team of researchers and engineers in the development of advanced packaging solutions, ensuring seamless integration of new...

  • Advanced Packaging Solutions Expert

    1 week ago

    Singapore beBeePackaging Full time $150,000 - $250,000

    Job DescriptionGlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.Lead 3DHI process development efforts for the building blocks required for advanced packaging solutions needed in product lines and planning by working with unit process...