Advanced Semiconductor Packaging Specialist
2 days ago
This role is a crucial part of our team, focusing on the development and optimization of TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.
The successful candidate will be responsible for designing innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding, ensuring precise, uniform, and rapid thermal control during the process.
Key Responsibilities:- Design & Development:
- Develop cutting-edge 3D designs and 2D drawings for TCB modules assemblies.
- Manage Bill of Materials (BOM), perform Failure Mode Effects Analysis (FMEA), error budgeting, and Design for Manufacturability and Assembly (DFMA).
- Plan, schedule, and cost machines modules effectively.
- Prototyping & Testing:
- Oversee the fabrication of prototype modules and their integration with TCB platforms.
- Analyze test results to identify design improvements and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Process & Manufacturing Support:
- Collaborate with Electrical, Vision, and Software Engineers for machine integration.
- Work closely with the process team to enhance the bonding machine, including bonder heads, stages, temperature/power controls.
- Collaborate with manufacturing engineers to ensure safe, robust assembly of module systems.
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