
3D Integration Specialist for Hybrid Bonding Development
1 week ago
This role is focused on leading the development of 3D heterogeneous integration processes. The ideal candidate will have expertise in hybrid bonding, particularly multi-layer stacking.
Key Responsibilities- Process Development:
- Design and implement advanced packaging solutions, including multi-die stacking and fine pitch hybrid bonding.
- Collaborate with vendors and outsourced semiconductor assembly and test (OSAT) providers to develop wafer-level and die-level 2.5D and 3DHI processes.
- Facilitate interactions between product line and fab teams and customers to advance packaging technology.
- A master's degree in a relevant field such as electrical engineering, mechanical engineering, or materials science.
- A minimum of 12 years of experience in a related field, preferably with a strong background in project management.
- Excellent written and verbal communication skills are essential for this role.
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R&d Expert
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