3D Integration Specialist for Hybrid Bonding Development

1 week ago


Singapore beBeeIntegration Full time $150,000 - $200,000
Job Summary

This role is focused on leading the development of 3D heterogeneous integration processes. The ideal candidate will have expertise in hybrid bonding, particularly multi-layer stacking.

Key Responsibilities
  • Process Development:
  • Design and implement advanced packaging solutions, including multi-die stacking and fine pitch hybrid bonding.
  • Collaborate with vendors and outsourced semiconductor assembly and test (OSAT) providers to develop wafer-level and die-level 2.5D and 3DHI processes.
  • Facilitate interactions between product line and fab teams and customers to advance packaging technology.
Requirements
  • A master's degree in a relevant field such as electrical engineering, mechanical engineering, or materials science.
  • A minimum of 12 years of experience in a related field, preferably with a strong background in project management.
  • Excellent written and verbal communication skills are essential for this role.

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