SMTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)

6 days ago

Singapore GLOBALFOUNDRIES SINGAPORE PTE. LTD. Full time
Roles & Responsibilities

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive thermal solutions for next-generation hybrid bonding development.

Essential Responsibilities:

  • Lead 3DHI process development efforts for establishing thermal solutions required for advanced packaging solutions needed in the product lines (e.g., multi-die stacking, fine pitch hybrid bonding, etc.) and planning by working with the unit process engineers, manufacturing engineers, as well as directly with the tools & materials for the GF Singapore semiconductor fabs.
  • Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
  • Develop expertise in the processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
  • Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3DHI processes.
  • Drive understanding of failure modes.
  • Facilitate advanced packaging interactions between the GF Singapore Product Line/Fab teams and customers.
  • Generate IP related to novel wafer integration & packaging technology.

Other Responsibilities:

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
  • Take part in hiring of other Advanced Packaging team members in Singapore.
  • Mentor and guide new hires to assume their roles and responsibilities.
  • Other duties as assigned by manager.

Required Qualifications:

  • Education – Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 10 years of prior related work experience. ​
  • Language Fluency - English (Written & Verbal).
  • Travel - Up to 20%.

Preferred Qualifications:

  • Education – PhD education level preferred with at least 8 years of prior related work experience.
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
  • Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning & organizational skills.
Tell employers what skills you have

Management Skills
Integration
Materials Science
Process Integration
3D
Fabrication
Environmental Health
Project Management
Characterization
IP
Packaging
Assembly
Manufacturing
Electrical Engineering
Chemical Engineering
Mechanical Engineering

  • SMTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)

    2 hours ago

    Singapore GlobalFoundries Full time

    SMTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)Join to apply for the SMTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)role at GlobalFoundries SMTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)5 days ago Be among the first 25 applicants Join to apply for the SMTS - 3D...

  • Smts Integration Engineer

    5 days ago

    Singapore GLOBALFOUNDRIES Full time

    **About**GlobalFoundries** **Introduction** **Responsibilities**: - Lead Integration Activities: Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies, ensuring seamless collaboration between design, process, and manufacturing teams. - Technical Expertise: Provide technical guidance and expertise in 2.5D and 3D packaging...

  • Advanced Thermal Solutions Specialist

    1 day ago

    Singapore beBeeThermalEngineering Full time $90,000 - $120,000

    We are seeking an experienced thermal engineering professional to drive the development of advanced packaging solutions for next-generation hybrid bonding. The ideal candidate will have a strong background in thermal engineering and materials science, with experience in process integration and planning. They will be responsible for leading 3D Heterogeneous...

  • Thermal Bonding Engineer

    6 days ago

    Singapore beBeeThermal Full time

    Job Title: Thermal Bonding Specialist "> A Thermal Bonding Specialist is responsible for designing, developing and optimizing thermal bonding modules used in advanced semiconductor packaging. This role is critical for ensuring precise, uniform and rapid thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process...

  • Thermal Bonding Engineer Position

    3 days ago

    Singapore beBeeThermalBonding Full time $80,000 - $120,000

    Job Title: Thermal Bonding Specialist">The role of a Thermal Bonding Specialist is crucial in ensuring precise, uniform and rapid thermal control during chip-to-wafer or chip-to-substrate bonding.Design & Development: Design innovative thermal bonding modules assemblies for chip-to-wafer or chip-to-substrate bonding. Key responsibilities include creating 3D...

  • PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)

    2 hours ago

    Singapore GlobalFoundries Full time

    PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)Join to apply for the PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)role at GlobalFoundries PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)3 days ago Be among...

  • Thermal Bonding Systems Specialist

    4 days ago

    Singapore beBeeBonding Full time $6,000 - $8,000

    Job Title: Advanced Thermal Bonding EngineerA highly skilled and innovative engineer is required to lead the design, development, and optimization of advanced thermal bonding modules.Key Responsibilities:Design & Development:Design innovative thermal bonding assemblies for chip-to-wafer or chip-to-substrate applications.Develop 3D designs and 2D drawings,...

  • 3D Integration Specialist for Hybrid Bonding Development

    1 week ago

    Singapore beBeeIntegration Full time $150,000 - $200,000

    Job SummaryThis role is focused on leading the development of 3D heterogeneous integration processes. The ideal candidate will have expertise in hybrid bonding, particularly multi-layer stacking.Key ResponsibilitiesProcess Development:Design and implement advanced packaging solutions, including multi-die stacking and fine pitch hybrid bonding.Collaborate...

  • Advanced Packaging Specialist

    3 days ago

    Singapore beBeeThermal Full time

    Thermal Solutions Engineer About Our Client: We are seeking an experienced Thermal Solutions Engineer to drive the development of advanced packaging solutions for next-generation hybrid bonding. The ideal candidate will have a strong background in thermal engineering and materials science, with experience in process integration and planning. They will...

  • Heterogeneous Integration Specialist

    3 hours ago

    Singapore beBeeIntegration Full time $125,000 - $175,000

    Job Title:3D Heterogeneous Integration EngineerJob Summary:We are seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.Lead 3DHI process development efforts for the building blocks required for advanced packaging solutions needed in product lines.Drive end-to-end...