Physical Chip Design Engineer

2 weeks ago

Singapur, Singapore SUNLUNE (SINGAPORE) PTE. LTD. Full time

Job Overview

We are seeking a highly skilled and experienced Senior Physical Chip Design Engineer to lead the development and optimization of low-power, high-performance chip design processes. This role requires a deep understanding of advanced semiconductor technologies and the proven ability to oversee full-chip physical design workflows from floor planning to signoff. The ideal candidate will be responsible for driving innovation in power efficiency and performance while ensuring the successful tape-out of complex integrated circuits.

Key Responsibilities
  • Lead the development and optimization of low-power physical design workflows to enhance energy efficiency.
  • Oversee full-chip floor planning and place-and-route management to ensure optimal performance, power, and area utilization.
  • Architect and optimize power distribution networks to maintain power integrity and minimize losses, conducting thorough power grid analysis.
  • Drive timing closure efforts, collaborating with cross-functional teams to meet challenging performance targets.
  • Take ownership of power integrity and signal integrity signoff, performing necessary analysis and optimizations.
  • Lead comprehensive design rule checks (DRC) and layout versus schematic (LVS) verifications to ensure design compliance and correctness.
  • Utilize and optimize industry-standard physical design tools such as Synopsys IC Compiler, Cadence Innovus, or equivalent.
  • Leverage strong scripting and programming skills (Perl, TCL, Python, C++) to automate tasks and improve design efficiency.
  • Mentor and provide technical guidance to junior physical design engineers.
Qualifications
  • Bachelor’s degree or higher in Electronics, Electrical Engineering, Computer Science, or a related field. Advanced degrees (Master’s or Ph.D.) are advantageous.
  • Minimum 7-8 years of hands-on experience in full-chip physical design with a strong focus on low-power and high-performance chip design.
  • Proven experience with advanced semiconductor technologies (12nm and below) and successful tape-out processes.
  • Strong expertise in full-chip floor planning, place-and-route methodologies, and physical verification (DRC and LVS).
  • In-depth knowledge of power network design, IR drop analysis, and timing closure principles and methodologies.
  • Hands-on experience with Static Timing Analysis (STA) tools.
  • Proficient in scripting and programming languages, including Perl, TCL, Python, and C++.
  • Strong problem-solving skills, attention to detail, and excellent communication and leadership abilities.
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