Process Integration Manager

2 days ago


Central Region, Singapore Adecco Personnel Pte Ltd. Full time $150,000 - $250,000 per year

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The Opportunity:

Adecco is partnering with a renowned Semiconductor company that manufactures FC-BGA substrates used in bleeding edge semiconductor products such as network switches and artificial intelligence (AI) or machine learning (ML) devices.

We are looking for a Process Integration Manager to join the company as a pioneer team member and lead integration of multiple process modules into reliable, high yielding short-loop and full-flow substrate builds

The Job:

  • Define and develop short loop process flows to quickly validate new interconnect architectures and materials.
  • Ensure cross-process compatibility, manage material interactions and track substrates/panels across virtual development lines.
  • Drive dimensional control, sidewall profile fidelity, film thickness uniformity and electrical performance across integrated builds.
  • Implement and refine process monitoring techniques and defect inspection, to proactively investigate and resolve issues with various processes.
  • Troubleshoot yield detractors and process failures by coordinating root cause analysis across teams.
  • Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters. Experience with data analysis software packages (such as MATLAB, Python, SQL, JMP).
  • Lead process-of-record (POR) definition and development of integrated module flows.
  • Work closely with design, product engineering, module owners, reliability, metrology and failure analysis teams to validate integration feasibility, support process scale-up and enable new product introduction (NPI).
  • Assist with customer qualifications, electrical and reliability testing as needed.

The Talent:

  • 5-10 years of experience in process integration in semiconductor industry.
  • Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
  • Hands-on experience with substrate technology integration or advanced packaging integration (e.g., 2.5D/3D IC, interposers).
  • Experience with virtual fab management and cross-site material tracking.
  • Exposure to reliability testing, failure analysis (FA) tools, and mechanical stress modeling.
  • Knowledge of tool qualifications, process transfer from pilot to HVM and supply chain collaboration.
  • Using AI/ML to enhance process discovery

Next Steps:

  • Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
  • Apply through this application or send your resume to in MS Word Copy. We'd love to hear from you
  • We regret that only shortlisted candidates will be notified.

Loo Hui Yang

Direct Line:

EA License No: 91C2918

Personnel Registration Number: R



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