Advanced Package Engineering Manager

Job Title: Process Engineer Laser-Assisted Bonder "> Location: Admiralty, Singapore Job Summary: The Laser-Assisted Bonding Process Engineer plays a crucial role in developing and optimizing laser bonding processes for advanced packaging applications. Key responsibilities include process development and optimization, equipment management, and...

**About**GlobalFoundries** **Introduction**: We are looking for an experience Engineer in Semiconductor Advanced Packaging. You will be the technical lead in the development, optimization, and implementation of advanced packaging technologies, ensuring high yield, quality, and reliability in semiconductor manufacturing. Additionally, you will establish and...

We are seeking a skilled Process Engineer to join our team in developing, optimizing, and maintaining laser bonding processes for advanced packaging applications. About the Role Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly. Qualify new laser bonding processes from R&D...

Job Description As a highly skilled Process Engineer, you will play a key role in the development, optimization, and maintenance of laser bonding processes. Develop and implement laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly. Qualify new laser bonding processes from R&D to high-volume production. ...

Optimize Chip-to-Wafer/Chip-to-Substrate packaging processes using Laser-Assisted Bonding. Develop and implement scalable production techniques from R&D to high-volume manufacturing.Responsibilities:Program and troubleshoot Laser Bonder equipment for optimal performance.Apply statistical analysis and Six Sigma principles to improve yield, quality, and...

Job Title: Advanced Thermal Management Engineer for Semiconductor PackagingThe role of an Advanced Thermal Management Engineer is pivotal in designing, developing, and optimizing the thermal control systems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.Responsibilities:Design and development of innovative thermal...

Roles & ResponsibilitiesMicron's vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual...

Job Title: Process Engineer for Advanced PackagingWe are seeking an experienced Process Engineer to join our team in the development and optimization of laser bonding processes. The successful candidate will be responsible for developing, implementing, and refining advanced packaging applications for Chip-to-Wafer or Chip-to-Substrate...

Job Description We are seeking an experienced engineer to join our team in developing advanced packaging equipment. The successful candidate will be responsible for designing, optimizing, and implementing innovative solutions for wafer-level packaging and stacking. They will work closely with cross-functional teams to integrate manufacturing processes...

Process Optimization Specialist We are seeking an experienced Process Optimization Specialist to develop and optimize laser bonding processes for high-precision, high-reliability advanced packaging applications. Develop recipes and parameters to achieve maximum yield, quality, and throughput. Qualify new laser bonding processes from R&D to high-volume...