Advanced Packaging Engineer

2 weeks ago


Singapore beBeeLaserBonding Full time $6,000 - $8,000

Optimize Chip-to-Wafer/Chip-to-Substrate packaging processes using Laser-Assisted Bonding. Develop and implement scalable production techniques from R&D to high-volume manufacturing.

Responsibilities:

  • Program and troubleshoot Laser Bonder equipment for optimal performance.
  • Apply statistical analysis and Six Sigma principles to improve yield, quality, and throughput.
  • Collaborate with cross-functional teams for New Product Introduction (NPI) and customer projects.
  • Ensure compliance with laser safety regulations in the production environment.

Requirements:

  • Degree in Materials or Mechanical Engineering.
  • 2–5 years of experience in Semiconductor Packaging and Advanced interconnects.
  • Knowledge of X-ray inspection tools and strong understanding of Statistical Process Control (SPC).
  • Familiarity with Failure Modes and Effects Analysis (FMEA) and JMP/Minitab software.

Key Skills:

  • Laser bonding
  • Process optimization
  • Equipment programming
  • Statistical analysis
  • Compliance management


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