
Advanced Packaging Engineer
2 weeks ago
Optimize Chip-to-Wafer/Chip-to-Substrate packaging processes using Laser-Assisted Bonding. Develop and implement scalable production techniques from R&D to high-volume manufacturing.
Responsibilities:
- Program and troubleshoot Laser Bonder equipment for optimal performance.
- Apply statistical analysis and Six Sigma principles to improve yield, quality, and throughput.
- Collaborate with cross-functional teams for New Product Introduction (NPI) and customer projects.
- Ensure compliance with laser safety regulations in the production environment.
Requirements:
- Degree in Materials or Mechanical Engineering.
- 2–5 years of experience in Semiconductor Packaging and Advanced interconnects.
- Knowledge of X-ray inspection tools and strong understanding of Statistical Process Control (SPC).
- Familiarity with Failure Modes and Effects Analysis (FMEA) and JMP/Minitab software.
Key Skills:
- Laser bonding
- Process optimization
- Equipment programming
- Statistical analysis
- Compliance management
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