Advanced Packaging Lead Engineer
1 week ago
Senior Packaging Expert
About the Role
- We are seeking an accomplished Senior Packaging Expert to lead our packaging efforts and drive innovation in semiconductor technology.
- This position involves developing strategic plans, collaborating with cross-functional teams, and ensuring timely delivery of high-quality solutions.
Key Responsibilities:
- Design and implement advanced packaging technologies for various markets, including mobile, IoT, consumer, and high-performance computing.
- Liaise with internal stakeholders to develop leading-edge packaging solutions from concept to production.
- Analyze and mitigate project risks to guarantee successful outcomes and meet deadlines.
Requirements:
- Minimum 10 years of hands-on experience in semiconductor technology and processing in cleanroom environments.
- In-depth knowledge of Advanced Packaging architecture, encompassing flip-chip, Through-Silicon Via, Re-Distribution Layer, Singulation, Hybrid Bonding, and assemblies.
- Proficiency in unit processes BEOL & Packaging Assembly Unit Process (e.g., Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding).
- Strong understanding of high-density interconnects, mechanical, thermal, and reliability issues, as well as cost tradeoffs of various interposers process technologies.
- Able to tackle complex problems, drive projects to completion, and communicate effectively across functions and geographies.
- Bachelor's, Master's, or Doctorate in STEM disciplines (Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering).
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