Advanced Packaging Process Engineer
2 days ago
We are seeking a skilled Process Engineer to join our team in developing, optimizing, and maintaining laser bonding processes for advanced packaging applications.
About the Role
- Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.
- Qualify new laser bonding processes from R&D to high-volume production.
- Specify, program, and refine laser bonder equipment and processes.
Key Responsibilities
- Process Development & Optimization: Develop and implement laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.
- Process Qualification: Qualify new laser bonding processes from R&D to high-volume production.
- Equipment Management: Specify, program, and refine laser bonder equipment and processes.
Requirements
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2-5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
- Experience with Laser Assisted bonding technologies is highly preferred.
Desired Skills
- Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).
- Familiarity with advanced process control and manufacturing best practices.
- Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
What We Offer
We offer a competitive salary and benefits package, as well as opportunities for professional growth and development.
How to Apply
Please submit your resume and cover letter to us via email. We look forward to hearing from you
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