Advanced Packaging Process Engineer
2 days ago
We are seeking an experienced Process Engineer to join our team in the development and optimization of laser bonding processes. The successful candidate will be responsible for developing, implementing, and refining advanced packaging applications for Chip-to-Wafer or Chip-to-Substrate bonding.
Responsibilities:- Develop and implement recipes for optimal laser-assisted bonding processes
- Qualify new laser bonding processes from R&D to high-volume production
- Specify, program, and refine laser bonder equipment and processes
- Troubleshoot laser systems and bonding processes
- Lead initiatives to improve yield, cycle time, and cost using data-driven methodologies
The ideal candidate will possess a strong understanding of process engineering principles and experience with laser bonding technology. They will be skilled in problem-solving and have excellent communication and collaboration skills.
Requirements:- Bachelor's degree in Engineering or related field
- At least 3 years of experience in process engineering or related field
- Strong knowledge of laser bonding technology
- Excellent problem-solving and analytical skills
- Effective communication and collaboration skills
Benefits: Our company offers a competitive salary, comprehensive benefits package, and opportunities for professional growth and development.
Additional Information:Maintain accurate records of process parameters, recipes, and results for compliance and technology transfer purposes.
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