Process Engineer for Advanced Packaging Etch Process Optimization

10 hours ago


Singapore beBeeEtch Full time $80,000 - $120,000
Advanced Packaging Etch Process Development Engineer

Seeking a skilled and experienced process engineer to drive the development, optimization, and sustainability of advanced packaging etch processes. The ideal candidate will possess hands-on experience in TSV etch, plasma dicing, and bonding etch.

Key Responsibilities:

  • Develop and optimize etch processes for advanced packaging (TSV, plasma dicing, bonding)
  • Execute experiments, analyze data, and meet performance/yield/cost targets
  • Tool setup, qualification, matching, and troubleshooting
  • Drive process robustness using DOE, SPC, and Lean/Six Sigma tools
  • Work with equipment and integration teams on productivity and quality improvements
  • Support process ownership, reliability testing, and continuous improvement
  • Mentor junior engineers and ensure EHS compliance

Requirements:

  • Bachelor's or higher in Engineering, Physics, or relevant field
  • Hands-on experience in TSV etch, plasma dicing, bonding etch
  • Strong data analysis, problem-solving, and cross-functional collaboration skills

Preferred Qualifications:

  • Master's or PhD in related field
  • Strong communication and interpersonal abilities, especially in cross-cultural settings

Benefits:

  • Competitive compensation package
  • Opportunities for professional growth and development
  • A dynamic and collaborative work environment


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