
Process Engineer for Advanced Packaging Etch Process Optimization
10 hours ago
Seeking a skilled and experienced process engineer to drive the development, optimization, and sustainability of advanced packaging etch processes. The ideal candidate will possess hands-on experience in TSV etch, plasma dicing, and bonding etch.
Key Responsibilities:
- Develop and optimize etch processes for advanced packaging (TSV, plasma dicing, bonding)
- Execute experiments, analyze data, and meet performance/yield/cost targets
- Tool setup, qualification, matching, and troubleshooting
- Drive process robustness using DOE, SPC, and Lean/Six Sigma tools
- Work with equipment and integration teams on productivity and quality improvements
- Support process ownership, reliability testing, and continuous improvement
- Mentor junior engineers and ensure EHS compliance
Requirements:
- Bachelor's or higher in Engineering, Physics, or relevant field
- Hands-on experience in TSV etch, plasma dicing, bonding etch
- Strong data analysis, problem-solving, and cross-functional collaboration skills
Preferred Qualifications:
- Master's or PhD in related field
- Strong communication and interpersonal abilities, especially in cross-cultural settings
Benefits:
- Competitive compensation package
- Opportunities for professional growth and development
- A dynamic and collaborative work environment
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