Etch Process Engineer

3 days ago

Singapore Ambition Singapore Full time

Seeking a skilled Process Engineer to develop, optimize, and sustain advanced packaging etch processes (e.g. TSV, plasma dicing, bonding) in a 300mm manufacturing environment. The role involves hands-on process development, tool qualification, and close collaboration across functions.
Key Responsibilities
Develop and optimize
etch processes
for advanced packaging (TSV, plasma dicing, bonding)
Execute experiments, analyze data, and meet performance/yield/cost targets
Tool setup, qualification, matching, and troubleshooting
Drive process robustness using
DOE, SPC , and
Lean/Six Sigma
tools
Work with equipment and integration teams on productivity and quality improvements
Support
process ownership , reliability testing, and continuous improvement
Mentor junior engineers and ensure EHS compliance
Ideal Requirements
Bachelor's or higher in Engineering, Physics, or relevant field
Hands-on experience in
TSV etch, plasma dicing, bonding etch
Strong data analysis, problem-solving, and cross-functional collaboration skills
Preferred: Master's or PhD in related field
Strong communication and interpersonal abilities, especially in cross-cultural settings
If you would like to be considered for this opportunity, please forward a copy of your full CV to
Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.
Business Registration Number : D | Licence Number : 10C5117 | EA Registration Number: R
If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer SGD1,000 or SGD350 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.
Etch Process Engineer - Advanced Packaging
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