Advanced Packaging Process Expert

Job TitleA seasoned semiconductor expert is sought to join our Advanced Packaging team in Singapore. The ideal candidate will have extensive experience in designing and optimizing advanced packaging processes.

Job Description:We are seeking an experienced Advanced Packaging Engineer to join our team in Singapore. As a key member of our organization, you will be responsible for developing and optimizing advanced packaging processes for multi-stack bond wafers and die-to-wafer processes.The ideal candidate will have expertise in bonding, debonding, pre-bond plasma,...

We are seeking a skilled Process Engineer to join our team in developing, optimizing, and maintaining laser bonding processes for advanced packaging applications. About the Role Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly. Qualify new laser bonding processes from R&D...

We are seeking a skilled Process Engineer to join our team in developing, optimizing, and maintaining laser bonding processes for advanced packaging applications. About the Role Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly. Qualify new laser bonding processes from R&D...

Process Engineer - Advanced PackagingWe are seeking a skilled Process Engineer to develop advanced packaging technologies and processes for high-density, high-performance electronic devices.Develop and implement new manufacturing processes and technologies to improve device performance and yield.Collaborate with external customers and partners on technical...

**About**GlobalFoundries** **Introduction**: We are looking for an experience Engineer in Semiconductor Advanced Packaging. You will be the technical lead in the development, optimization, and implementation of advanced packaging technologies, ensuring high yield, quality, and reliability in semiconductor manufacturing. Additionally, you will establish and...

Job Title: Process Engineer for Advanced PackagingWe are seeking an experienced Process Engineer to join our team in the development and optimization of laser bonding processes. The successful candidate will be responsible for developing, implementing, and refining advanced packaging applications for Chip-to-Wafer or Chip-to-Substrate...

Job Title: Advanced Packaging SpecialistRole Description:The role of an advanced packaging specialist involves developing and implementing cutting-edge technologies for high-density electronic devices. This includes collaborating with external customers and partners to design and implement new processes.Responsibilities:Design and implement advanced...

As a key member of our organization, we are seeking an Advanced Packaging Solutions Expert to drive the development and integration of cutting-edge packaging solutions.Key Responsibilities include:Conducting gap-analysis, risk-assessment, and mitigation, as well as integration process flow developmentDeveloping 2.5D/3D process technologies and solutions for...

Job OpportunitySeeking a development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ultra-low power (ULP) CMOS platforms.The role spans from early-stage process development through to manufacturing. Key responsibilities include:Developing and implementing...