High-Temperature Bonding Specialist
2 weeks ago
A highly skilled professional is required to design and develop Thermo-Compression Bonding modules for advanced semiconductor packaging. The successful candidate will be responsible for creating innovative designs that ensure precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding.
Key Responsibilities:
- Design & Development : Design 3D models, create 2D drawings, manage Bills of Materials (BOM), conduct Failure Mode and Effects Analysis (FMEA), error budgeting, Design for Manufacturability and Assembly (DFMA), planning, scheduling, and costing of machines and modules.
- Prototyping & Testing : Oversee the fabrication of prototype modules, integrate them with TCB platforms, analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Process & Manufacturing Support : Collaborate with Electrical, Vision, and Software Engineers for machine integration, process team to improve bonding machines, and manufacturing engineers to ensure DFMA and safe assembly of module systems.
- Compliance & Documentation : Document all designs, simulations, and test results according to quality management and IP standards, stay updated on industry standards for environment, health, and safety, contamination control, and semiconductor packaging equipment.
Requirements include a Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field, along with 2-5 years of experience in design and development of equipment or semiconductor packaging. Proficiency in 3D/2D CAD knowledge, especially CREO Parametric, is preferred, as well as experience with TCB or Laser Assisted bonding technologies.
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