Advanced Package Development Engineer

7 days ago


Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time

We are seeking an experienced Packaging-Silicon Integration Engineer to join Micron's Package Development Engineering (PDE) Group. As a key member of our team, you will drive the development of advanced package technologies and collaborate with various functional teams to meet project requirements.

Responsibilities:
  • Work closely with package design and development teams to complete chip-package interaction risk assessment.
  • Collaborate with scribe designers and assembly engineers to identify and implement solutions for dicing problems and relevant design rules/FMEA.
  • Enable design for manufacturing in areas like die size, scribe width, and pad size by working with die designers.
  • Solve relevant issues and improve yield, quality, and manufacturability by collaborating with R&D/manufacturing wafer fabs and packaging teams.
  • Contribute to the development of new silicon and package technologies by engaging with Micron's internal factories.
  • Define test vehicles, plan DOE, characterize enabling technologies, document best-known-process, and hand-off to manufacturing.
  • Identify technology, quality, business process gaps, and develop solutions.
Requirements:
  • Masters or Bachelor's degree in Engineering (Mechanical, Materials Science, Electrical, Chemical) or related field.
  • 5-7 years of semiconductor fab experience in Chip-Package Interaction and Integration.
  • Strong Project/Program Management skills.
  • Possess sound methodology for organizing work, decision-making, and setting priorities.
  • Strong analytical, problem-solving, and organizational skills.
  • Proficiency in computer applications like Excel, Word, PowerPoint.
  • Self-motivated and team-oriented.
  • Strong interpersonal, oral, and written communication skills.
Estimated Salary: SGD 120,000 - SGD 180,000 per annum

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