Advanced Package Development Engineer
7 days ago
We are seeking an experienced Packaging-Silicon Integration Engineer to join Micron's Package Development Engineering (PDE) Group. As a key member of our team, you will drive the development of advanced package technologies and collaborate with various functional teams to meet project requirements.
Responsibilities:- Work closely with package design and development teams to complete chip-package interaction risk assessment.
- Collaborate with scribe designers and assembly engineers to identify and implement solutions for dicing problems and relevant design rules/FMEA.
- Enable design for manufacturing in areas like die size, scribe width, and pad size by working with die designers.
- Solve relevant issues and improve yield, quality, and manufacturability by collaborating with R&D/manufacturing wafer fabs and packaging teams.
- Contribute to the development of new silicon and package technologies by engaging with Micron's internal factories.
- Define test vehicles, plan DOE, characterize enabling technologies, document best-known-process, and hand-off to manufacturing.
- Identify technology, quality, business process gaps, and develop solutions.
- Masters or Bachelor's degree in Engineering (Mechanical, Materials Science, Electrical, Chemical) or related field.
- 5-7 years of semiconductor fab experience in Chip-Package Interaction and Integration.
- Strong Project/Program Management skills.
- Possess sound methodology for organizing work, decision-making, and setting priorities.
- Strong analytical, problem-solving, and organizational skills.
- Proficiency in computer applications like Excel, Word, PowerPoint.
- Self-motivated and team-oriented.
- Strong interpersonal, oral, and written communication skills.
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