Electrical Engineering Specialist for Advanced Packaging and FEOL Development
4 weeks ago
We are seeking an Electrical Engineering Specialist to join our team in Advanced Packaging and FEOL Development at Micron.
About the RoleThe successful candidate will be responsible for identifying, selecting, and evaluating new equipment and technologies to support current and future requirements for the FEOL area.
Key Responsibilities:
- Define, develop, and establish new equipment design and capability requirements aligned to the Process and Packaging Roadmap.
- Develop creative solutions for new equipment capabilities and address identified constraints or future technology requirements.
- Work with equipment suppliers to develop new capabilities and engage in active participation in Package Development Engineering activities.
- Conduct equipment benchmarking to establish equipment suppliers and platforms for future needs.
- Create decision matrices for equipment and material selection and installation qualification of new equipment platforms.
To be successful in this role, you will need:
- A PhD/Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or equivalent work experience required.
- Basic knowledge in semiconductor manufacturing assembly & wafer bumping packaging technologies & techniques.
- Minimum 2 years' experience in related semiconductor industry.
- Experience with technical knowledge on assembly and/or wafer bumping packaging technology.
- Advantage packaging technology and Front end of line background will be preferable and a plus point.
In return for your expertise, we offer:
- An estimated salary range of $120,000 - $180,000 per year, based on location and experience.
- A competitive benefits package, including health insurance, retirement plan, and paid time off.
- The opportunity to work with a talented team of engineers and contribute to the development of innovative technologies.
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