Advanced FEOL Engineer with Equipment Development Expertise
1 week ago
Unlock the Future of Semiconductor Manufacturing
As an Advanced FEOL Engineer at Micron, you will play a critical role in developing and implementing innovative solutions to drive process improvements. Our vision is to transform how the world uses information to enrich life for all.
We are seeking a highly skilled and motivated individual to join our team as an Advanced FEOL Engineer. In this role, you will be responsible for identifying, selecting, and evaluating new processes, equipment, and technologies to support current and future requirements for the Front End of Line (FEOL) area.
Key Responsibilities:- Evaluate New Process, Equipment, and Technology
- Define, develop, and establish new process, equipment design, and/or capability requirements aligned to the Process and Packaging Roadmap
- Develop and engage creative solutions for new process, equipment capabilities, and/or solutions to identified constraints or future technology requirements
- Work with Suppliers to Develop New Capability
- Work with equipment suppliers to develop new capability
- Conduct Benchmarking and Qualification
- Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future needs
- Create decision matrices for equipment and material selection
- Installation and Qualification of New Equipment Platform
- Plan/submit capital requests to acquire new equipment
- Create purchasing specifications (Doc2) documents
- Establish new equipment qualification criteria and activities roadmaps with respective functional teams
- Establish project handover requirements and procedures upon machine qualification
- Prepare documentation for handing over with respective site owners
- Maintain Key Equipment Platform Capabilities and Constraints
- Maintain and regularly update the Tool of Records (TOR) with inputs from local or other assembly sites
- Maintain general knowledge of process and material characteristics and translate to equipment design requirements
- Search continually for new equipment or suppliers with improved or new capabilities that align with Process/Packaging needs
- Education and Experience:
- PhD/Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or equivalent work experience required
- Minimum 2 years' experience in related semiconductor industry
- Technical Knowledge:
- Basic knowledge in semiconductor manufacturing assembly & wafer bumping packaging technologies & techniques
- Experience with technical knowledge on assembly and/or wafer bumping packaging technology
- Soft Skills:
- Fast learner with initiative and independence (min supervision)
- Good team player with ability to integrate and cooperate with cross-functional teams and external vendors
- Strong communication and presentation skills
- Understanding of business needs and customers' requirements
- Strong project management skills to ensure execution to timelines
The estimated salary for this role is around $120,000 - $150,000 per year, depending on location and experience.
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