Principal Engineer for Advanced Packaging Technology

7 days ago


Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time
About the Role
As a highly experienced Principal Engineer in Package Development Engineering at Micron Semiconductor Asia Operations PTE. LTD., you will play a crucial role in driving the success of our Advance Packaging technology within your scope (MRDA). Reporting to functional objectives, you will be responsible for defining, developing, and optimizing process, equipment, and materials that meet or exceed defined metrics. This position requires an individual with extensive knowledge and technical leadership skills to collaborate with internal and external partners in building and implementing packaging technology roadmaps aligned to corporate strategic objectives.

Key Responsibilities
1. Identify, select, and evaluate new processes, equipment, and/or technologies to support current and future requirements for MRDA area
2. Define, develop, and establish new process, equipment design, and/or capability requirements aligned to Process and Packaging Roadmap
3. Develop and engage creative solutions for new process, equipment capabilities, and/or solutions to identified constraints or future technology requirements
4. Work with equipment suppliers to develop new capabilities
5. Actively participate in Package Development Engineering activities
6. Conduct equipment benchmarking to establish equipment suppliers and platforms for current and future needs
7. Create decision matrices for equipment and material selection
8. Generate and set-up ADCs, set-up/improve recipes
9. Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators

Requirements
This role requires a Bachelor/Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, or a related field. A PhD is a plus. With 4 or more years of experience in Semiconductor Manufacturing, preferably in MRDA Process & Equipment Engineering, this individual must have a proven track record of technical leadership in semiconductor manufacturing. Experience in other Front-End areas, in PWF & HBM technology, is advantageous. The ideal candidate should be able to work across organizational boundaries and geographies, effectively collaborating with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements. Strong analytical skills and organizational competency are essential, along with excellent written and oral communication skills in English.

Estimated Salary: SGD $120,000 - $180,000 per annum
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