Sr/Manager, Advance Packaging

1 week ago


Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time
Roles & Responsibilities

We are looking for a Sr/Manager in PDE (Package Development & Engineering) who will be accountable for the Advance Packaging success within your scope and guided by functional objectives. You will be responsible for the overall management and direction of Advanced Packaging process, equipment and materials definition, development and/or optimization. You will be forming and developing a high performing team and the development of current and future PDE & Micron leaders. You will be steering, managing and optimizing departmental performance to meet or beat defined metrics. You will apply extensive knowledge to carry out strategies and collaborate with internal and external partners to build technology strategies aligned to corporate strategic objectives. You will provide advice to senior and executive management related to strategic decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.


KEY RESPONSIBILITIES and TASKS

Building an Effective Team Members and Managing Group Performance

  • Develop a high performing team.
  • Establish department objectives aligned to company strategic objectives and goals.
  • Prioritize objectives, remove barriers, and drive for accountability.
  • Establish job responsibilities, performance goals and development goals for direct reports.
  • Provide performance feedback on an ongoing basis and conduct performance appraisal for direct reports. Collect, review, and provide verbal and written performance feedback to continuously develop your team.
  • Optimize department performance and structure. Monitor and oversee department performance achievement and provide timely intervention on initiatives that needs help.
  • Coach, mentor and develop current and future Micron leaders. Assess talent and develop talent management strategies.
  • Support learning opportunities within department and plan development opportunities for direct reports.
  • Provide consultation or implement timely intervention to prevent or resolve conflicts with minimal noise.
  • Establish strategies to provide and support recognition.
  • Promote and oversee partnerships across functional areas and customer groups.
  • Uses communication skills to resolve sensitive or difficult issues

Drive and Provide Leadership to Achieve Functional Objectives and Vision

  • Provide organizational leadership to build functional strategies & processes, and collaborate with partners to deliver strategic solutions
  • Lead the setup and commissioning of the new manufacturing facility, ensuring it is equipped and optimized for Advance Packaging production.
  • Establish organizational roadmaps and strategies. Apply extensive knowledge and tenacity to carry out strategies.
  • Develop and monitor department performance to plan. Develop and measure department metrics and oversee functional metrics to ensure deliverables are met.
  • Collaborate with peers to construct global solutions.
  • Ensure conflict resolution and assist with identifying critical issue paths.
  • Align internal strategies and communicate line of sight to corporate strategic objectives.
  • Communicate the corporate business environment and initiatives and provide direction.
  • Establish and communicate department capabilities to ensure partner expectations are aligned.
  • Manage conflict and build effective relationships with internal and external partners.
  • Initiate and sustain effective communication with internal and external partners.
  • Provide advice to senior and executive management on strategic decisions
  • Establishes and manages budget/finances for the team

Develop, qualify & continually improve Advance Packaging process/equipment/materials

  • Oversee the development and optimization of semiconductor packaging processes specific to Advance Packaging and collaborating with engineers in CMP, WET, ETCH, PHOTO, CVD, Bonding, debonding, Wafer prep, Hybrid bonding, TCB & pre/post encap departments to ensure high yield and quality standards are met.
  • Perform process and tool capability assessment. Assess & validate CTQ (critical to quality).
  • Define and implement the necessary quality system and documentation, encompassing initial design to full-scale production.
  • Coordinate and implement NPI samples build, and engineering samples build during NPI qualification.
  • Accountable in improving the yield, quality and reliability through proper process definition, characterization and optimization.
  • Work with cross functional team for a successful process/equipment/material development, CIP, and on other key strategic projects & programs implementation.
  • Manage the selection, installation, and maintenance of equipment necessary for Advance Packaging. Collaborate with vendors and internal teams.
  • Identify risks and mitigation plans with partners & alignment with cross functional teams.
  • Drive programs to satisfactory conclusion.
  • Identify, diagnose and resolve issues during NPI phase by applying problem solving skills
  • Develop and manage budgets for facility operations, including forecasting, cost controls, and resource allocation

New Product Introduction & Development of Process of Record (POR)

  • Evaluate new risk identified with new products and provide engineering solutions and train workforce, if necessary
  • Monitor new product quality indices with process maturity index
  • Working with engineering team on any issues/ problems, potential risk & opportunities
  • Define process variables, critical parameters, boundaries condition, process optimization via process characterization to establish & define POR/TOR/MOR
  • Validate and document baseline for transferred products and packages.

Requirements

  • Bachelor'or Masters in Electrical Engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
  • 8 or more years of experience in Semiconductor Manufacturing on leadership capacity, with proven track record of technical leadership in semiconductor manufacturing, with expertise in Front End, PWF, HBM technology, process development, and/or equipment management.
  • Strong leadership and vision and must be able to comfortably work across organizational boundaries and geographies.
  • Demonstrated ability to influence executives, senior leaders and partners on strategic decisions across multiple functions and geographies.
  • Ability to effectively collaborate with cross-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
  • Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
  • Ability to be guided by business objectives and determine best methods for delivering results.
  • Organized, meticulous, and strong focus on results.
  • Demonstrated ability to inspire teamwork and to effectively lead others.
  • Proven facilitation skills including the ability to influence others, build consensus, and resolve conflict.
  • Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
  • Excellent analytical skills and organizational competency
  • With good oral and written English communication skill


Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.


Tell employers what skills you have

Executive Management
Materials Science
Leadership
Quality System
Process Simulation
Conflict Resolution
Reliability
Packaging
Process Optimization
Life Sciences
WPS
Performance Appraisal
Manufacturing
Electrical Engineering
Organizational Leadership

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