Advanced Semiconductor Packaging Designer
16 hours ago
We are seeking a highly skilled Senior Package Design Engineer to join our team at Micron Semiconductor Asia Operations PTE. LTD.
About the RoleThis is a challenging and rewarding role that involves designing and developing advanced semiconductor packaging solutions. You will work closely with a multi-functional team across several geographies to create package design databases, including package stack-up, simulation, route-study, substrate/lead frame layout, wire bond diagrams, and other design documentation.
Key Responsibilities- Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
- Work closely with the multi-functional team to address packaging design challenges in the area of layout, electrical, thermal, mechanical, assembly, and reliability.
- Interact with the PDE assembly team and external assembly subcontractor partners to recommend package solutions that meet customer and/or market requirements.
- Generate and update assembly documents in the database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
- Support package and DFMEA reviews with assembly engineering and subcon teams.
- Support package technology development, including material selection, process development, DOEs, and related activities.
- Track and drive program milestones to ensure timely development execution.
- Provide design support for thermal/mechanical/electrical simulation analysis.
- A Master's degree (preferred) or Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 5 years of experience in the semiconductor packaging industry OR PhD graduates in Electrical Engineering.
- Candidates must possess a strong design knowledge of high-density (Wirebond + Flip-Chip) packaging architectures, die stack-up, packaging layout optimization.
- Excellent communication skills, both oral and written in English.
- Excellent problem-solving and analytic skills.
- Experience with Cadence SIP, APD, and AutoCAD software tools is preferred.
- Good understanding of Silicon IP, floorplan, and Signal/Power Integrity is a plus.
- Ability to work independently, prioritize, and manage numerous projects with minimum supervision.
- A global perspective and the ability to work in a multicultural environment.
The estimated salary for this role is around $120,000 per annum, depending on location and experience.
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