Advanced Semiconductor Equipment Designer

1 week ago


Singapore beBeeDesign Full time $6,000 - $8,000

As a TCB Design Engineer, you will be responsible for designing Thermal Bonding Modules for Chip-to-Wafer/Chip-to-Substrate bonding. This role requires strong technical expertise and the ability to work collaboratively with cross-functional teams.

Key Responsibilities
  • Create 3D models, 2D drawings, Bill of Materials (BOMs), Failure Mode and Effects Analysis (FMEA), Design for Manufacturing and Assembly (DFMA) to ensure design accuracy and compliance.
  • Manage Prototyping, Testing, and Troubleshooting for thermal performance, including optimizing Heating/Cooling Systems through thermal simulations (Computational Fluid Dynamics/Finite Element Analysis).
  • Collaborate with Electrical, Vision, and Software teams for machine integration and ensure seamless production transfer.
  • Maintain Documentation for Intellectual Property and quality standards, adhering to DFMA requirements.
Requirements
  • Degree in Materials Science, Mechanical or Electrical Engineering or related field.
  • 2–5 years of experience in Semiconductor Equipment Design or packaging.
  • CAD skills (Parametric preferred), Product Lifecycle Management (Windchill a plus).
  • Experience with Thermal Bonding/Laser-Assisted Bonding is a plus, as well as knowledge of Bonding tools (X-ray, Scanning Acoustic Microscopy, Optical Microscopy, etc.).


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