Senior Advanced Packaging Specialist

5 days ago

Singapore beBeeIntegration Full time

3D Heterogeneous Integration Engineer

We are seeking a highly skilled and experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to lead next-generation multi-layer stacking for hybrid bonding development.

  • Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
  • Develop expertise in the processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
  • Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3DHI processes.
  • Drive understanding of failure modes.
  • Facilitate advanced packaging interactions between the Product Line/Fab teams and customers.
  • Generate IP related to novel wafer integration & packaging technology.

Required Skills:

  • Education: Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 12 years of prior related work experience.
  • Must have at least an overall 3.0 GPA and proven good academic standing.
  • Language Fluency: English (Written & Verbal).
  • Travel: Up to 20%.

Benefits:

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
  • Take part in hiring of other Advanced Packaging team members in Singapore.
  • Mentor and guide new hires to assume their roles and responsibilities.

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