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Advance Packaging Leader

2 weeks ago

Singapore beBeeLeadership Full time $150,000 - $250,000
Job Description

As a Senior Manager in Package Development and Engineering, you will be responsible for leading the Advance Packaging team to achieve exceptional results.

You will oversee the development and optimization of semiconductor packaging processes specific to Advance Packaging, collaborating with engineers in various departments to ensure high yield and quality standards are met.

The ideal candidate will have a strong background in Front End, Post Wafer Fabrication, and High Bandwidth Memory Technology management, with excellent leadership and vision skills.

">Required Skills and Qualifications
  • Bachelor's or Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
  • 8 or more years of experience in Semiconductor Manufacturing on leadership capacity, with proven track record of technical leadership in semiconductor manufacturing.
  • Strong leadership and vision skills, with ability to comfortably work across organizational boundaries and geographies.

Key qualifications include the ability to influence executives, senior leaders, and partners on strategic decisions, as well as effectively collaborate with cross-functional organizations to understand needs and translate them into actionable plans.

">Benefits

Micron Technology offers a comprehensive benefits package, including competitive salary, stock options, and opportunities for professional growth and development.

We value diversity and inclusion, and welcome applicants from diverse backgrounds.