Advanced Packaging Solutions Leader

3 days ago


Singapore beBeePackaging Full time

Key Responsibilities

  • Lead and mentor a diverse team of researchers and engineers in the development of advanced packaging solutions, aligning with strategic business objectives.
  • Manage multiple R&D projects through conceptualization, design, prototyping, and implementation, ensuring timely delivery within budget constraints.
  • Collaborate cross-functionally with teams such as Product Development, Manufacturing, and Quality Assurance to ensure seamless integration of new technologies into production processes.
  • Monitor industry trends and emerging technologies in advanced packaging, driving innovation and contributing to long-term technological leadership.
  • Prepare and present research findings, progress updates, and recommendations to senior management and relevant stakeholders to support informed decision-making.

Qualifications

  • A Master's degree or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a closely related field.
  • At least 8 years of relevant industry experience, including 3 years or more in a managerial or leadership capacity overseeing R&D or technology projects.
  • Strong technical knowledge in areas such as System-in-Package (SiP), Fan-Out Wafer-Level Packaging (FOWLP), and Heterogeneous Integration.
  • Demonstrated ability to manage complex projects, including planning, resource coordination, and risk management.
  • Strong analytical, problem-solving, and communication skills, with the ability to address technical challenges and influence stakeholders effectively.


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