
Senior Thermal Control Engineer
3 days ago
TCB Design Engineer
This role is crucial for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding.
About the Role
- Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
- Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
- Planning, Scheduling and Costing of Machines Modules.
Responsibilities
- Design & Development
- Prototyping & Testing
- Process & Manufacturing Support
- Compliance & Documentation
Requirements
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2-5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
- 3D/2D CAD knowledge, with experience in CREO Parametric preferred.
This is a challenging opportunity to apply your skills and experience in the field of TCB Design Engineer. If you are passionate about technology and innovation, we encourage you to apply for this position.
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