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Roles & Responsibilities Lithography Engineer / Manager Are you passionate about pushing the boundaries of lithography technology? We're seeking an innovative Lithography Engineer/ Manager to drive breakthrough solutions in advanced packaging. This is your opportunity to work at the forefront of panel lithography and 2.5D/3D IC integration, where your expertise will directly impact next-generation semiconductor solutions. What You'll Do Lead Innovation in Lithography Development Own end-to-end lithography process development for cutting-edge advanced packaging solutions Pioneer panel lithography technologies that will define industry standards Design and implement manufacturable processes that deliver exceptional yield and repeatability Drive continuous improvement initiatives focused on cost reduction, cycle time optimization, and yield enhancement Shape Technology from the Ground Up Define specifications for next-generation lithography equipment and lead tool validation efforts Collaborate with equipment vendors and cross-functional teams to bring innovative solutions from concept to production Integrate AI/ML methodologies to accelerate process discovery and optimization Solve Complex Technical Challenges Lead root cause analysis and resolution of lithography defects using advanced characterization techniques Implement sophisticated process monitoring systems and statistical analysis (DOE, SPC) to maintain tight process control Work seamlessly with upstream and downstream process teams (plating, deposition, etching) to ensure flawless integration Drive Quality Excellence Develop and deploy advanced defect inspection strategies using state-of-the-art tools (optical inspection, SEM, AFM) Create comprehensive documentation including SOPs, work instructions, and control plans Support customer qualifications and reliability testing to ensure world-class product quality Collaborate Across the Organization Partner with design, product engineering, and manufacturing teams to enable successful new product introductions (NPI) Participate in strategic product risk management discussions, leveraging your expertise to influence critical decisions Mentor team members and contribute to a culture of technical excellence Required Qualifications Education: PhD or Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field Experience: 5–10+ years in lithography development, with demonstrated success in advanced packaging applications Technical Expertise Deep knowledge of lithography processes and equipment for advanced packaging (2.5D/3D IC, interposers, panel-level packaging) Hands-on experience with metrology and characterization tools: CD-SEM, optical film metrics, XRF, 4PP, ellipsometry, profilometry Proficiency in defect analysis using optical inspection, SEM, and AFM Strong statistical analysis skills with experience in DOE, SPC, and data-driven decision making Ability to independently create recipes and run wafers on lithography metrology systems Professional Skills Exceptional problem-solving abilities with a track record of resolving complex technical challenges Outstanding communication skills with the ability to influence and collaborate across functions Strong documentation skills and attention to detail Experience applying AI/ML techniques to process optimization is highly valued If you are a good match for the role above, please reach out to Ritu Chaudhari for a confidential chat today at UEN: D | EAs: 14S7084 / R Tell employers what skills you have RecipesAFMMaterials ScienceSemiconductor IndustryE-beam lithographyLithographyDocumentation SkillsUpstreamProduct EngineeringCharacterizationSPCXRFSemiconductorsFilmProcess OptimizationMetrologyProcess ControlChemical Engineering