Current jobs related to LAB (Laser-Assisted Bonding) Process Engineer - Semiconductor Packaging - YZ11 - Singapore - THE SUPREME HR ADVISORY PTE. LTD.
-
Semiconductor Process Engineer
6 days ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : Laser-Assisted Bonder (LAB) process engineer / Semiconductor Process Engineer (Laser Bonding)Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding...
-
Laser Bonding Expertise
2 days ago
Singapore beBeeBonding Full timeJob Title: Laser-Assisted Bonder (LAB) Process Engineer Laser-assisted bonding is a critical process in semiconductor packaging and advanced interconnects. As a LAB Process Engineer, you will be responsible for developing, optimizing, and maintaining laser bonding processes to achieve high precision and reliability. Key Responsibilities: Process...
-
Laser Bonding Process Engineer
2 weeks ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeRoles & ResponsibilitiesLaser Bonding Process Engineer (Semiconductor/ Advanced Packaging)Location: Admiralty, Singapore Work Schedule: 5 Days, 9AM–6PM Salary: S$ 6,000 – 8,000 (Based on Experience)Key Responsibilities:Develop & optimize Laser-Assisted Bonding processes for Chip-to-Wafer/ Chip-to-Substrate packaging. Scale processes from R&D to...
-
Laser Bonding Technology Specialist
1 day ago
Singapore beBeeBonding Full time $80,000 - $120,000Job Title: Laser-Assisted Bonder (LAB) Process EngineerLaser-assisted bonding is a critical process in semiconductor packaging and advanced interconnects. As a LAB Process Engineer, you will be responsible for developing, optimizing, and maintaining laser bonding processes to achieve high precision and reliability.Key Responsibilities:Process Development &...
-
Advanced Laser Bonding Process Engineer
1 day ago
Singapore beBeeLaserBonding Full time $6,000 - $8,000Process Engineer - Laser Bonding SpecialistWe are seeking a highly skilled and experienced Process Engineer to develop, optimize, and maintain advanced laser bonding processes for our packaging applications.Main Responsibilities:Develop, implement, and refine laser-assisted bonding processes for product packaging, interconnects, or micro-assembly.Qualify new...
-
Advanced Packaging Laser Bonding Process Engineer
24 hours ago
Singapore beBeeBonding Full time $6,000 - $8,000Job Summary">We are seeking a skilled Laser Bonding Process Engineer to join our team. The successful candidate will be responsible for developing and optimizing laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.">About the Role">The Laser Bonding Process Engineer will play a crucial role in qualifying new...
-
Laser Bonding Expertise
4 days ago
Singapore beBeeBonding Full time $6,000 - $8,000Job Title: Laser-Assisted Bonder (LAB) Process EngineerLaser-assisted bonding is a critical process in semiconductor packaging and advanced interconnects. As a LAB Process Engineer, you will be responsible for developing, optimizing, and maintaining laser bonding processes to achieve high precision and reliability.Key Responsibilities:Process Development &...
-
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeLaser-Assisted Bonder (LAB) process engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging...
-
Laser Bonding Process Engineer
6 days ago
Singapore beBeeLaserBonding Full timeJob Title:Laser Equipment SpecialistDescriptionWe are seeking a skilled Laser Equipment Specialist to join our team. The successful candidate will be responsible for developing, optimizing, and maintaining laser bonding processes, with a focus on high-precision and high-reliability applications.Key Responsibilities:• Develop and implement laser-assisted...
-
Singapore beBeeLaserBonding Full time $90,000 - $120,000Job Title: Advanced Packaging Process SpecialistWe are seeking a skilled professional to develop and optimize laser bonding processes for high-precision applications.About the Role:Create, implement, and refine laser-assisted bonding processes for product packaging and advanced interconnects.Qualify new laser bonding processes from R&D to high-volume...
LAB (Laser-Assisted Bonding) Process Engineer - Semiconductor Packaging - YZ11
3 weeks ago
Position title : Laser-Assisted Bonder (LAB) process engineer
Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Overview
A LAB Process Engineer is responsible for developing, optimizing, and maintaining
laser bonding processes —especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.
Key Responsibilities
Process Development & Optimization:
Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
Scale-Up & Qualification:
Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
Equipment & Program Management:
Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
Troubleshooting & Support:
Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
Continuous Improvement:
Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
Documentation:
Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
Cross-Functional Collaboration:
Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
Safety & Compliance:
Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
Customer & Project Support:
Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
Laser Maintenance & Calibration (Good-to-have):
Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.
Requirements
Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
Experience with
Laser Assisted bonding technologies
is highly preferred. Familiarity with laser or optical systems is necessary.
Familiarity with
bonding equipment and analytical tools
(X-ray, SAM, OM, etc.)
Familiarity with advanced process control and manufacturing best practices
Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
Knowledge of
bonding process and materials behaviour under thermal/mechanical stress
(e.g., CTE mismatch, flux residue, underfill cure).
Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus
Interested applicants, WA your resume to or email your resume to
TAN YEN ZHEN (CHEN YANZHEN) REG NO: R
THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C727
#J-18808-Ljbffr
