Advanced Semiconductor Packaging Solutions Specialist

2 weeks ago

Singapore beBeeThermal Full time

Key Role Summary: ">

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  • A leading global semiconductor company is seeking a highly skilled TCB (Thermo Compression Bonding) Design Engineer to join their team. ">
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Job Description

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This position involves the design, development, and optimization of TCB modules subsystems used in advanced semiconductor packaging. As a key member of our engineering team, you will be responsible for designing innovative solutions to meet customer requirements while ensuring precise thermal control during Chip-to-Wafer or Chip-to-Substrate bonding. This role plays a critical part in ensuring process reliability, yield, and throughput.

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Responsibilities

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The successful candidate will have the following responsibilities:

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  • Design & Development: Design novel TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. ">
  • 3D/2D CAD Design: Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, and Design for Manufacturability and Assembly (DFMA). ">
  • Prototyping & Testing: Oversee the fabrication of prototype modules and their integration with TCB platforms. Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation. ">
  • Process & Manufacturing Support: Collaborate with Electrical, Vision, and Software Engineers for machine integration. Work with the process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls). Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems. ">
  • Compliance & Documentation: Document all designs, simulations, and test results according to quality management and IP standards. ">
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Requirements

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To be considered for this position, candidates must possess:

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  • Bachelor's or Master's degree: In Materials Science, Mechanical Engineering, Electrical Engineering, or a related field. ">
  • Minimum 2-5 years of experience: In design and development of equipment or semiconductor packaging or advanced interconnect processes. ">
  • 3D/2D CAD knowledge: With experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus. ">
  • Experience with TCB technologies: Highly preferred. Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.) ">
  • Excellent trouble-shooting skills: Risk analysis, FMEA, and statistical analysis (JMP, Minitab). ">
  • Knowledge of bonding process: And materials behavior under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure). ">
  • Experience with thermal system/component design: Heaters, sensors, thermal interfaces, including hands-on and simulation skills. ">
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Tan Yen Zhen
EA NO: 14C7279

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