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Packaging Engineering Director

2 weeks ago

Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time

Job Summary:

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We are seeking an experienced Senior/Manager, Advance Packaging professional to lead the development and optimization of advanced packaging processes, equipment, and materials.

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Main Responsibilities:

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  2. Develop and implement strategies to improve departmental performance and structure.">
  3. Collaborate with cross-functional teams to develop and qualify new packaging processes and materials.">
  4. Evaluate new product risk and provide engineering solutions to ensure successful product introduction.">
  5. Manage the selection, installation, and maintenance of equipment necessary for advance packaging.">
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Essential Qualifications:

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  • Bachelor's or Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, or related field.">
  • At least 8 years of experience in semiconductor manufacturing leadership, with expertise in front-end, PWF, HBM technology, process development, and/or equipment management.">
  • Demonstrated ability to influence executives, senior leaders, and partners on strategic decisions across multiple functions and geographies.">
  • Strong leadership and vision to drive global initiatives and collaborate with cross-functional organizations.">
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Working with Us:

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Micron Semiconductor Asia Operations PTE. LTD. offers a dynamic work environment and opportunities for career growth.