Thermal Solutions Innovator

1 week ago

Singapore beBeeThermal Full time $90,000 - $120,000
Job Description

We are seeking an experienced Senior R&D Engineer to lead the development of cutting-edge thermal solutions for next-generation hybrid bonding. The successful candidate will oversee process development efforts and collaborate with cross-functional teams to establish thermal solutions required for advanced packaging.

Key Responsibilities:

  • Lead the development of 3DHI process integration and planning to enable new capability planning, early product prototyping, and qualification across multiple programs.
  • Develop expertise in processes, materials, and tooling leveraging available characterization resources.
  • Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes.

Required Skills and Qualifications

To be considered for this role, you must possess:

  • A Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field.
  • At least 10 years of prior related work experience.
  • Fluency in English (written and verbal).
  • The ability to travel up to 20%.

Benefits

This is an exciting opportunity to contribute to the development of cutting-edge technologies. You will have the chance to work with a dynamic team, utilize your leadership skills, and innovate solutions that make a difference.

Other Responsibilities

In addition to leading process development efforts, you will be responsible for:

  • Performing all activities in a safe and responsible manner, adhering to Environmental, Health, Safety & Security requirements.
  • Mentoring and guiding new hires to assume their roles and responsibilities.

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