High-Precision Process Engineer for Advanced Packaging Applications
2 weeks ago
A laser bonding process engineer is responsible for developing and optimizing high-precision, high-reliability processes for advanced packaging applications.
Main Responsibilities:
- Process Development: Develop and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.
- Process Qualification: Qualify new laser bonding processes from R&D to high-volume production.
- Equipment Specification: Specify, program, and refine laser bonder equipment and processes.
- Troubleshooting: Troubleshoot laser systems and bonding processes.
To be successful in this role, you will need the following skills and qualifications:
- Education: Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Experience: Minimum 2–5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
- Technical Skills: Experience with Laser Assisted bonding technologies, familiarity with bonding equipment and analytical tools, and knowledge of bonding process and materials behaviour under thermal/mechanical stress.
This role offers a range of benefits, including:
- Professional Growth: Opportunities to develop and improve your skills and knowledge in the field of laser bonding.
- Collaboration: The chance to work closely with cross-functional teams, including R&D, operations, maintenance, and quality teams.
Please note that this job description may be subject to change.
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