Advanced Packaging Equipment Specialist

2 weeks ago

Singapore beBeeEngineering Full time $80,000 - $150,000

Advanced Packaging Equipment Engineer Position

We are seeking a highly skilled and motivated engineer to become part of our team at the 300mm Advance Packaging Center in Singapore.

The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advanced Packaging (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level), do troubleshooting for process and tool issues.

Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.


Job Responsibilities:

  • Manage new equipment start-up, qualification and tool matching to support production, from facilities hookup, vendor startup, to acceptance of equipment for production.

  • Designing, executing, and analyzing experiments to develop advanced packaging process (bond/debond, die re-constitution, annealing/RTA) to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. Tool stability, cost of ownership) targets.

  • Liaise & work with vendors to resolve equipment issues and improve equipment performance.

  • Improve Equipment robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.

  • Establish Preventive Maintenance (PM) plans for all equipment and optimize PM for quality, cost, and productivity.

  • Sustain and improve on SPC, DOE, FDC, ECMS and all the statistical analysis tools to optimizing equipment robustness.

  • Implement equipment improvement projects to improve equipment efficiency, cost reduction and reliability of equipment.

  • Provide long term solution to address daily issues. Resolve department hardware chronicle issues.

  • To work closely with Process team to improve equipment productivity indices.

  • Establish stock levels of essential spare parts and consumables to support equipment maintenance based on forecasted manufacturing volume. Liaise with vendors to minimize / eliminate over-stock or under-stock.

  • Forecast financial budgets for equipment expenditures.


Required Skills and Qualifications:

  • Bachelor's degree in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or other relevant engineering physical science discipline is required.

  • Relevant working experiences in various Metrology Equipment in Advanced packaging Bonder (TEL W2W/ BESI D2W), die re-constitution & Annealing (TEL Alpha 303, mattson-helios) process tool.

  • Excellent verbal and written communication skills.

  • Strong interpersonal skills and ability to work effectively with different cultures.


Benefits:

We offer a comprehensive compensation package including benefits such as [list benefits here].


Information about Our Company:

We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

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