
High Performance Product Engineer
7 days ago
Our company focuses on developing memory and storage solutions that enable innovation.
The role of a product engineer involves driving the development of high-performance products, including DRAM, NAND, and NOR memory and storage solutions. This includes defining and executing test flows, managing risk, promoting innovation, and mentoring others.
To be successful in this role, you will need to have strong leadership skills, technical skills, and problem-solving abilities. You should also have a good understanding of CMOS technology, DRAM device physics, and design.
Additionally, you will need to have good knowledge of statistics and data analysis tools and scripting. You will work closely with cross-functional teams to address complex business and engineering problems.
Responsibilities:
- Define and develop reliability stress, test flows, and test plans to cover all product reliability aspects.
- Work closely with quality teams to define qualification plans, review, and manage qualification execution progress, and drive for qualification gating issue resolution.
- Drive down extrinsic reliability (time 0 and field DPM) and intrinsic reliability through optimized manufacturing test flows and test strategies to meet critical KPIs quality, cost, and cycle time.
- Debug and identify root cause and failures in reliability tests by electric failure analysis (EFA) and physical failure analysis (PFA) and drive for resolution and improvements through cross-functional team collaboration.
- Provide recommendations to fab teams for new process conversions to reduce costs, increase yields.
- Communicate with product managers/leads to manage risks associated with DPM process conversions.
- Promote innovation and drive changes that provide a technical advantage over competitors.
- Mentor and develop others within the team.
- Develop project management skills within the team to ensure efficient execution of projects.
- Make final decisions on risk analysis and project prioritization.
- Collaborate with various cross-functional teams such as fab, HBM technology development, HBM design, system development, and quality/reliability teams.
Requirements:
- Bachelor's or master's degree in electrical and electronics engineering or related fields.
- Demonstrating strong leadership skills and technical skills, especially in problem solving with root cause understanding and solution space through in-depth circuit analysis.
- Basic understanding of CMOS technology and DRAM device physics and design.
- Good knowledge of statistics and data analysis tools and scripting.
- Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment.
- Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
- Strong sense of responsibility and accountability towards assigned role with professional work ethic.
- Effective communication skills in written and spoken English to articulate technical concepts and findings.
About Our Company:
We are an industry leader in innovative memory and storage solutions. We focus on delivering high-performance DRAM, NAND, and NOR memory and storage products through our brands. Our goal is to enable innovation across the data center, intelligent edge, and client user experience.
Benefits:
Our company offers a competitive compensation package, opportunities for growth and development, and a collaborative working environment.
Others:
Our company is committed to diversity, equity, and inclusion, and we welcome applicants from diverse backgrounds.
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