3D Heterogeneous Integration Thermal Solutions Engineer
5 hours ago
This role requires an experienced R&D engineer to drive thermal solutions for next-generation hybrid bonding development.
The engineer will lead the 3D heterogeneous integration process development efforts and collaborate with vendors and OSATs to develop new wafer level and die level processes.
About the Role:- Develop and implement innovative thermal solutions required for advanced packaging solutions.
- Drive end-to-end process integration and planning to enable new capability planning, early product prototyping, and qualification across multiple programs.
- Collaborate with cross-functional teams to develop expertise in processes, materials, and tooling leveraging available characterization resources.
- Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field.
- At least 10 years of prior related work experience.
- Language fluency in English (written and verbal).
Key Responsibilities:
- Leads the 3DHI process development effort to establish thermal solutions for advanced packaging solutions.
- Drives end-to-end process integration and planning to enable new capability planning, early product prototyping, and qualification across multiple programs.
- Collaborates with vendors and OSATs to develop new wafer level and die level processes.
Requirements:
- Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field.
- At least 10 years of prior related work experience.
- Language fluency in English (written and verbal).
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