Senior Heterogeneous Integration Engineer

Job Title: Senior Heterogeneous Integration EngineerWe are seeking a talented engineer to join our team and play a key role in the development of complex products. As a Senior Heterogeneous Integration Engineer, you will be responsible for coordinating with internal and external teams to ensure seamless product development.Key Responsibilities:Coordinate...

Overview Scientist (Heterogeneous Integration), IME The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication...

Job OverviewDrive innovation in 3D heterogeneous integration by leading process development efforts and collaborating with vendors to create next-generation multi-layer stacking solutions.Key Responsibilities:Develop advanced packaging processes leveraging available characterization resources.Collaborate with cross-functional teams to integrate new...

**Key Responsibilities**: **Heterogeneous Integration**: Engage in the complete process of module integration, including die preparation (dicing and back-grinding) and combining components into fully functional modules. **Equipment Operation**: Operate and maintain various high-tech instruments used in the heterogeneous integration process, ensuring they are...

Overview Job Title: Heterogeneous Integration Research Engineer Company: A*STAR - Agency for Science, Technology and Research, Institute of Microelectronics (IME)About Us The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on advanced packaging such as...

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Research Engineer or Senior Research Engineer to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D...

Job Title:3D Heterogeneous Integration EngineerJob Summary:We are seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.Lead 3DHI process development efforts for the building blocks required for advanced packaging solutions needed in product lines.Drive end-to-end...

Job DescriptionWe are seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.Lead 3DHI process development efforts for advanced packaging solutions.Develop expertise in processes, materials, and tooling.Collaborate with vendors and OSATs to develop new wafer level...

About Us: The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on pioneering platforms such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics, essential for the next generation of heterogeneous chiplet...

Job Title: Heterogenous Integration Research Engineer About Us: The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on advanced packaging such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics. At IME,...