Senior Research Engineer

11 hours ago

Singapore A*STAR RESEARCH ENTITIES Remote Work Freelance Full time
The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Research Engineer or Senior Research Engineer to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.
Key Responsibilities
  • Support R&D in advanced semiconductor packaging processes, including flip-chip, hybrid bonding, and related integration techniques.
  • Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications
  • Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
  • Conduct engineering experiments for process characterization to drive quality and yield improvements.
  • Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance.
  • Lead capability development projects with manageable risks and mentor less experienced colleagues.
  • Collaborate with senior staff and principal investigators to develop process capability and new.
  • Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.

Qualifications and Skills
Candidates should meet the following criteria:
  • Educational Background: Bachelors in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
  • Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications.
  • Technical Expertise: Hands-on experience in flip chip bonding is preferable
  • Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory.
  • Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
  • Excellent written and verbal communication abilities.
  • Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
  • Heterogeneous integration and advanced packaging is preferred, but candidates with relevant semiconductor process or packaging experience are welcome to apply.

What We Offer
  • The opportunity to work on cutting-edge research in advanced packaging and heterogeneous integration.
  • A collaborative and interdisciplinary work environment.
  • Access to state-of-the-art facilities and resources.
  • Join us in shaping the future of semiconductor technologies and heterogeneous integration. Apply today

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