Failure Analysis, Senior Engineer

1 week ago


Singapore QUALCOMM GLOBAL TRADING PTE. LTD. Full time
Roles & Responsibilities

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Failure Analysis Engineer, you will evaluate electrical and mechanical characteristics of systems and/or integrated circuits, components, and sub-components to determine the cause of failure. Qualcomm Engineers collaborate with various teams to perform failure analyses and solve unique challenges as they arise.

Job Responsibilities:

  • Provide failure analysis (FA) support for customer issues using various FA tools and techniques.
  • Demonstrate expertise in electrical fault isolation (EFI) techniques such as thermal emission, photon emission, OBIRCH/TIVA, and dynamic laser stimulation, along with physical failure analysis (PFA) applications including CSAM, X-ray, sample preparation, chemical etching, SEM/EDX, and FIB for both package and silicon die level analysis.
  • Collaborate closely with cross-functional teams, including Product Test Engineering and RMA Engineering, to verify and validate failures, set up tests, and characterize failure modes using various automated test equipment (ATE) or bench setups.
  • Establish correlations between EFI and PFA results through GDS layout and schematic analysis, and compile comprehensive FA reports.
  • Participate in the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects.
  • Take ownership of equipment to ensure optimal working conditions, including troubleshooting and maintenance in collaboration with vendors.

Job Requirements:

  • Degree in IC Design, Electrical Engineering, Computer Engineering, Material Science, or a related field.
  • Minimum of 3 years of experience in failure analysis or testing within the semiconductor industry.
  • Familiarity with semiconductor fabrication, testing, assembly, and packaging processes.
  • Strong communication skills and a team-oriented mindset.
  • Preferred knowledge and experience in RF, Bluetooth, WLAN, Design for Test (DFT) Diagnosis, and ATE (93K/Teradyne).
  • Knowledge of programming/scripting languages such as Python is an advantage.
Tell employers what skills you have

Test Equipment
RF
Semiconductor Industry
Test Engineering
Electrical
Fabrication
Bluetooth
WLAN
Stimulation
Packaging
Teamoriented
Assembly
IC
Electrical Engineering
Layout
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