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Flip Chip Process Engineer
3 weeks ago
Job Description:
Job
To support Pre-Assy assembly new devices and current High Volume Manufacturing devices
Engineering Evaluation
Qualification Stage
Ramp-up to production
Communicate to customer
production
Cost Saving
To Manage and coordinate Engineering, Qual and Pre-production activities for new devices
Communicate with customer on new device requirement
Manage documentation for new device
Key role is qualifying new devices for production loading
Keep and maintain devices for free quality excursion
Requirement:
Degree in Electrical/ Electronics/ Mechanical/ Materials Engineering with 5 years related experience
Preferably with at least 5 years preferably in Pre-Assy Process experience on Back grind, Laser Groove, Wafer Sawing
Know how to use JMP software, SAP system
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel:
EA License Number: 02C4944
EA Personnel Reg nos R1110618
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